TEMPLE · Sep 2024 – Jun 2025

Cerebral blood-flow wearable

A sub-4 mm neuro wearable, taken from R&D to production

A person wearing TEMPLE's small gold wearable on the side of the head, at the temple
Image: TEMPLE (temple.com)
< 4 mm
Device thickness
200
Units built and shipped in-house
2 months
To build and ship those first 200
Role
Hardware Engineer / Head of Production
Organization
TEMPLE
Period
Sep 2024 – Jun 2025
Website
temple.com ↗
Tools and methods
  • SolidWorks
  • Flex PCB
  • Optical sensing
  • Injection molding
  • Over-molding
  • Ultrasonic welding
  • CMF
  • DFX
  • FDA and CDSCO documentation

A wearable that monitors blood flow to the brain continuously and non-invasively, in a package under 4 mm thick. I owned the hardware from system design to production and built the first 200 units in-house in two months.

The product

TEMPLE builds a wearable that monitors cerebral blood flow continuously and non-invasively. The device is under 4 mm thick, which takes tight component stacking and a flexible PCB. In February 2026 TEMPLE raised $54 million in its first funding round, at a $190 million valuation (TechCrunch). A 2024 YourStory article lists me on the team.

What I owned

As Hardware Engineer and Head of Production, I owned the hardware end to end:

  • System architecture and component selection
  • Mechanical packaging inside a sub-4 mm envelope
  • Electronics integration on flexible substrates, and the optical interface
  • Production readiness and the hand-off to manufacturing

Taking it to production

  • Worked hands-on with suppliers in China and Japan on injection molding, over-molding and ultrasonic welding, and owned CMF (color, material and finish).
  • Used DFX decisions to stabilize assembly, reduce rework and make production repeatable.
  • Built and shipped the first 200 units in-house within two months, which let the company move into full production.
  • Wrote and maintained regulatory documentation for a Class I non-invasive device, aligned with FDA general controls and CDSCO registration.

The hard parts

  • Heat inside an ultra-compact enclosure
  • Signal integrity on flexible electronics
  • A biocompatible enclosure
  • Battery life for continuous monitoring